Semiconductor Hiring Directory

One of the world's largest silicon wafer manufacturers — grows and slices the raw material every chip starts from.

Makes silicon wafers and semiconductor materials/chemicals — spans both crystal growth and chemistry.

A silicon wafer manufacturer — grows and slices the raw material every chip starts from.

A materials chemistry company — formulates the photoresist that lithography exposes.

A materials chemistry company — formulates photoresist and related lithography chemicals.

The only maker of EUV lithography scanners in the world — the single most expensive machine category in a leading-edge fab.

Makes DUV lithography scanners — the smaller of the two non-EUV players behind ASML.

Makes DUV lithography scanners — the smaller of the two non-EUV players behind ASML.

The largest semiconductor equipment maker — deposition, etch, CMP, and ion implant tools across nearly every front-end step.

A leading deposition and etch equipment maker, especially known for plasma etch tools.

Makes deposition and epitaxy tools — ALD and epi reactors that grow thin films atom-layer by atom-layer.

A broad equipment maker spanning etch, deposition, coat/develop, and cleaning tools.

Makes furnace and CVD equipment for oxidation and thin-film deposition.

Makes CMP (chemical-mechanical polishing) equipment that flattens wafer surfaces between layers.

Specializes in ion implantation equipment — the tools that fire dopant atoms into a wafer.

Makes wafer cleaning and coat/develop track equipment used around nearly every fab step.

Specializes in rapid thermal processing equipment — the tools that anneal wafers.

The dominant maker of wafer inspection and metrology tools — the equipment that catches defects between process steps.

Makes process-control and metrology equipment for defect and film-property inspection.

Makes inspection, metrology, and etch equipment used across front-end fabrication.

The dominant maker of wafer dicing saws and grinders used to separate and thin dies.

Makes precision wafer-dicing saws that separate a finished wafer into individual dies.

Makes packaging assembly equipment — die bonders and wire bonders used across OSAT and advanced packaging.

A Dutch packaging equipment maker — die bonders and other advanced-packaging assembly tools.

Makes wire bonding equipment used to connect a die's pads to its package.

Makes automated test equipment (ATE) — the systems that electrically test finished chips before they ship.

Makes automated test equipment (ATE) — the systems that electrically test finished chips before they ship.

Makes semiconductor test handling and burn-in equipment — the systems that move and stress-test packaged chips.

Makes die-attach adhesive materials used to bond a die to its package substrate.

A materials company — makes die-attach adhesives and other packaging chemistries.

The world's largest pure-play foundry. Real fabs in Hsinchu, Tainan, and Taichung, Taiwan; Phoenix, Arizona; and Kumamoto, Japan.

Samsung's foundry division. Real fabs in Hwaseong and Pyeongtaek, South Korea, plus Austin and Taylor, Texas.

A major pure-play foundry, historically strong in mature and specialty process nodes. Headquartered in Hsinchu, Taiwan.

A major pure-play foundry focused on specialty and mature-node manufacturing. Headquartered in Malta, New York, with fabs also in Dresden, Germany and Singapore.

China's largest pure-play foundry. Headquartered in Shanghai, with fabs across mainland China.

A Japanese foundry startup, backed by the Japanese government and industry, aiming to bring leading-edge 2nm manufacturing back to Japan. Its own fab is being built in Chitose, Hokkaido.

An IDM (designs and manufactures its own chips) that also opened its fabs to outside customers as Intel Foundry. Major US fabs in Chandler, Arizona and Hillsboro, Oregon.

A major memory IDM — designs and manufactures its own DRAM and NAND flash. Major fabs in Boise, Idaho; Manassas, Virginia; and Hiroshima, Japan.

A major memory IDM. Headquartered and mainly fabbing in Icheon, South Korea — a different city from this pin's Incheon, despite the near-identical romanized name.

A major analog and embedded-processing IDM, especially known for automotive and industrial chips. Major fabs in Richardson and Sherman, Texas.

A diversified European IDM spanning automotive, industrial, and consumer chips. Headquartered in Geneva, with major fabs in France and Italy.

A major flash-memory IDM, spun off from Toshiba's memory business. Major fabs in Yokkaichi and Kitakami, Japan.

A Japanese IDM focused on automotive and industrial microcontrollers. Fabs across Japan, including Naka and Kofu.

A Chinese DRAM IDM, one of the newer entrants racing to build domestic memory manufacturing. Based in Hefei, China.

The world's largest OSAT (outsourced assembly and test) provider. Headquartered in Kaohsiung, Taiwan.

A major OSAT provider. Headquartered in Tempe, Arizona, with assembly/test operations across the Philippines, Korea, Japan, Portugal, and Vietnam.

A major Chinese OSAT provider, headquartered in Jiangsu, China.