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MY LEARNING

Your next step into
the semiconductor industry.

Start with one process. Build the understanding to explain what happens, then put it into practice in the virtual fab.

ONE LEARNING JOURNEY

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Follow your guide through cleanroom entry, material preparation and your first film release. The guide resumes at your next unfinished checkpoint.

Your process courses

Suggested learning order · all lessons are open

This is a teaching sequence, not a production wafer traveler. Real fabrication repeats and combines operations.

01Prepare the wafer

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    Reticle qualification

    Review contamination, hold a persistent defect and qualify a replacement.

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    Wafer cleaning

    Balance wash, rinse and dry steps for a changed wafer.

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    Thin-film deposition

    Explain reaction and delivery limits, then meet a new thickness target.

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02Form the device

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    Coat, expose & develop

    Follow the resist through track and scanner, then recover a changed formulation.

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    Plasma etching

    Clear the film while protecting the mask and underlying material.

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    Implantation & activation

    Distinguish dose, depth and activation within a thermal budget.

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03Connect and verify

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    CMP & planarization

    Clear overburden while controlling surface loss and cleaning residue.

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    Copper interconnect

    Build the wiring sequence and diagnose buried fill problems.

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    Inspection & metrology

    Choose sampling sites and defend a decision from measurements and defects.

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More pathways and guided exercises

Explore other pathways

Curriculum paths · module depth varies
15 PROCESS MODULES

Start from zero

For beginners — no prior semiconductor background assumed.

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11 PROCESS MODULES

Front-end fabrication

For learners focused on fab processes — the steps that actually build a transistor.

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3 PROCESS MODULES

Etch and deposition

For learners interested in Applied Materials, Lam, Tokyo Electron-style equipment.

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4 PROCESS MODULES

Lithography and resist

For learners interested in scanners, masks, resist, and develop.

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5 PROCESS MODULES

Packaging and test

For learners interested in OSATs, HBM, die attach, wire bond, and final test.

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My classes & assignments →Processes explored →Skills evidence →Look something up →

Lesson bookmarks and practice notebooks are stored in this browser. Signed-in assessment records remain separate; visiting a lesson does not prove mastery.