Every front-end step across all three fab sites, including the memory (DRAM) and analog/power process variants alongside the leading-edge logic flow.
1.Wafer Cleaning & OxidationKumamoto2.Photoresist Coat & ExposeTokyo3.EUV/DUV Lithography ExposureArizona4.Resist DevelopHsinchu5.Deposition / Etch CycleHsinchu6.Ion Implant & CMPArizona7.Rapid Thermal AnnealArizona8.Copper Interconnect (Damascene)Hsinchu9.DRAM Capacitor FormationIncheon10.Mature-Node DepositionTexas11.In-line Metrology & Defect InspectionKumamoto