The whole value chain in order: crystal growth, materials, lithography, front-end fabrication, and packaging — one coherent story from raw silicon to a finished, tested chip.
1.Czochralski Ingot PullFukushima2.Wafer Cleaning & OxidationKumamoto3.Photoresist Coat & ExposeTokyo4.EUV/DUV Lithography ExposureArizona5.Resist DevelopHsinchu6.Deposition / Etch CycleHsinchu7.Ion Implant & CMPArizona8.Rapid Thermal AnnealArizona9.Copper Interconnect (Damascene)Hsinchu10.In-line Metrology & Defect InspectionKumamoto11.Wafer DicingChiayi12.Die AttachZhunan13.Wire Bond & Mold EncapsulationZhunan14.HBM Die StackingChiayi15.Final Test & Burn-InZhunan