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SiliconSim

Packaging and test

The post-fab flow, and the industry's current AI-chip bottleneck: dicing, die attach, wire bond and mold, HBM die stacking, and final test/burn-in.

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Wafer Dicing

1.Wafer DicingChiayi2.Die AttachZhunan3.Wire Bond & Mold EncapsulationZhunan4.HBM Die StackingChiayi5.Final Test & Burn-InZhunan